Method of making a semiconductor device using a barrier and antireflective coating (BARC) layer

ABSTRACT

A method of forming a semiconductor device includes forming a dielectric layer over a substrate. The method includes forming a layer set over the dielectric layer, wherein the layer set comprises a plurality of layers. The method further includes forming a bottom antireflective coating (BARC) layer over the layer set. The method further includes etching the layer set to form a tapered opening in the layer set, wherein etching the layer set comprises etching at least one layer comprising a silicon-rich photoresist material layer and a second material layer different from the silicon-rich photoresist material, and the tapered opening has sidewalls at an angle with respect to a top surface of the dielectric layer. The method further includes etching the dielectric layer using the layer set as a mask to form an opening in the dielectric layer, wherein etching the dielectric layer comprises reducing a thickness of the layer set.

PRIORITY CLAIM

The present application is a continuation of U.S. application Ser. No.13/686,413, filed Nov. 27, 2012, which is incorporated herein byreference in its entirety.

RELATED APPLICATIONS

This application is related to U.S. application Ser. No. 13/714,756,entitled “METHOD OF MAKING A SEMICONDUCTOR DEVICE USING MULTIPLE LAYERSETS”, filed on Dec. 14, 2012, which is hereby incorporated by referencein its entirety.

BACKGROUND

As technology nodes shrink more emphasis is placed on the ability toreduce the distance between features in a semiconductor device. Reducingthe distance between features is limited by the uniformity of thefeatures in the semiconductor device because of the risk of shortcircuits forming between adjacent features. A minimum distance betweenfeatures to have an acceptable risk of short circuits is called acritical dimension. Processes which yield a highly uniform featurefacilitate smaller critical dimensions. Processes which yield featureshaving low uniformity result in larger critical dimensions.

BRIEF DESCRIPTION OF THE DRAWINGS

One or more embodiments are illustrated by way of example, and not bylimitation, in the figures of the accompanying drawings, whereinelements having the same reference numeral designations represent likeelements throughout. It is emphasized that, in accordance with standardpractice in the industry various features may not be drawn to scale andare used for illustration purposes only. In fact, the dimensions of thevarious features in the drawings may be arbitrarily increased or reducedfor clarity of discussion.

FIG. 1 is a flow chart for a method of patterning a semiconductor deviceusing multiple layer sets, in accordance with one or more embodiments;

FIGS. 2A-2F are cross-sectional views of the semiconductor device duringvarious points of the method of FIG. 1, in accordance with one or moreembodiments;

FIG. 3A is a top view of a via formed in an interlayer dielectric layerin accordance with one or more embodiments; and

FIG. 3B is a cross section view of a via formed in an interlayerdielectric layer in accordance with one or more embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are examples and are not intended to belimiting.

FIGS. 1-2F are directed to the formation of a single feature; however,one of ordinary skill in the art would recognize the process is usableto form a plurality of similar features simultaneously.

Electrical interconnections between various components of thesemiconductor device are formed within an inter-level dielectric (ILD)layer. The ILD layer is etched to create openings, such as holes ortrenches, for features which are later metalized in order to provide aconductive path for electrical signals to connect the variouscomponents. The uniformity of the openings etched into the ILD layerfactors into a determination of how closely packed the openings are ableto be formed to avoid short circuits forming between adjacent metalizedfeatures. In some techniques, the uniformity of the openings is measuredusing a line width roughness (LWR) parameter. As the LWR parameterincreases, the critical dimension also increases in order to preventshort circuits. In some techniques, a single layer set deposited overthe ILD layer is used to define a pattern for the openings in the ILDlayer during the etching process.

Another factor which influences the critical dimension is a wavelengthof a light source used during a lithography process. As the wavelengthof the light source decreases, the critical dimension also decreases.However, as the wavelength of the light source increases, the LWRparameter increases partially counteracting the reduced criticaldimension.

Line width roughness (LWR) is a parameter used to measure uniformity ofa feature. LWR is calculated by measuring a width of a plurality offeatures at several points along each feature. The measured widths arethen averaged to obtain an average feature width. LWR is the differencebetween a largest measured width and the average feature width. As thenumber of features measured or the number of points measured along eachfeature increases, the accuracy of the LWR measurement increases.However, the increased number of measurements will also increaseprocessing time.

LWR impacts the critical dimension of semiconductor devices becausefeatures having a low LWR are capable of being more densely placed in asemiconductor device. The uniformity of features in a semiconductordevice facilitates more accurate modeling of the separation betweenfeatures to achieve a desired resistance and capacitance performancemitigating a need to account for as large of an amount of manufacturingerror.

FIG. 1 is a flow chart for a method 100 of patterning a semiconductordevice using multiple layer sets, in accordance with one or moreembodiments. Method 100 begins with step 102 in which a layer set isformed over an inter-level dielectric (ILD) layer. In some embodiments,the layer set comprises a plurality of layers. Increasing a number oflayers in the layer set reduces the LWR of the final feature formed inthe ILD layer. However, as the number of layers within the layer setincreases, production cost increases due to greater material consumptionand production yield decreases due an increased number of etchingoperations. In some embodiments, each layer of the layer set is formedusing a same process, e.g., physical vapor deposition (PVD), atomiclayer deposition (ALD), sputtering, chemical vapor deposition (CVD) orother suitable processes. In some embodiments having a plurality oflayers, at least one layer of the layer set is formed by a differentprocess than at least another layer of the layer set.

Method 100 continues with optional step 104 in which a barrier andanti-reflective coating (BARC) layer is formed over the layer set. Insome embodiments, the BARC layer is formed using a PVD, ALD, sputtering,CVD, spin-on coating, or other suitable process.

Method 100 continues with step 106 in which a photoresist layer isformed over the BARC layer. In some embodiments, the photoresist layeris formed by spin-on coating or other suitable processes. Thephotoresist layer is formed to have a thickness greater than the BARClayer.

FIG. 2A is a cross sectional view of a semiconductor device 200 afterstep 106 of method 100, in accordance with one or more embodiments.Semiconductor device 200 includes a substrate 202, an etch stop layer(ESL) 204 over substrate 202 and an ILD layer 206 over the ESL. In someembodiments, ESL 204 is omitted and ILD layer 206 is over substrate 202.A layer set 208 is over ILD layer 206. Layer set 208 includes twolayers, a bottom layer 210 and a top layer 212. In some embodiments,layer set 208 includes more than two layers. In some embodiments, layerset 208 includes a single layer. A BARC layer 214 is over layer set 208.A photoresist layer 216 is over BARC layer 214.

In some embodiments, substrate 202 comprises an elementary semiconductorincluding silicon or germanium in crystal, polycrystalline, or anamorphous structure; a compound semiconductor including silicon carbide,gallium arsenic, gallium phosphide, indium phosphide, indium arsenide,and indium antimonide; an alloy semiconductor including SiGe, GaAsP,AlInAs, AlGaAs, GaInAs, GaInP, and GaInAsP; any other suitable material;or combinations thereof. In some embodiments, the alloy semiconductorsubstrate has a gradient SiGe feature in which the Si and Ge compositionchange from one ratio at one location to another ratio at anotherlocation of the gradient SiGe feature. In some embodiments, the alloySiGe is formed over a silicon substrate. In some embodiments, substrate202 is a strained SiGe substrate. In some embodiments, the semiconductorsubstrate has a semiconductor on insulator structure, such as a siliconon insulator (SOI) structure. In some embodiments, the semiconductorsubstrate includes a doped epi layer or a buried layer. In someembodiments, the compound semiconductor substrate has a multilayerstructure, or the substrate includes a multilayer compound semiconductorstructure.

In some embodiments, ESL 204 comprises silicon nitride (SiN), siliconoxynitride (SiON), silicon carbide (SiC), silicon carbon nitride (SiCN),boron nitride (BN), silicon boron nitride (SiBN), silicon carbon boronnitride (SiCBN), combinations thereof, or other suitable materials. Insome embodiments, ESL 204 is formed by gas cluster ion beams (GCIBs),PVD, ALD, sputter, CVD, or other suitable processes. In someembodiments, ESL 204 is a contact etch stop layer (CESL).

In some embodiments, ILD layer 206 comprises silicon oxide and/or low-kdielectric materials with a dielectric constant less than about 4. Insome embodiments, ILD layer 206 has a k value less than 3.5. In someembodiments, ILD layer 206 has a k value less than 2.5. Suitable low-kdielectric materials include fluorinated silica glass (FSG); carbondoped silicon oxide, BLACK DIAMOND® (Applied Materials of Santa Clara,Calif.), xerogel, aerogel, amorphous fluorinated carbon, parylene,bis-benzocyclobutenes (BCB), SILK® (Dow Chemical, Midland, Mich.),polyimide, porous polymeric materials, silicon oxide doped with materialother than fluorine or carbon, other suitable materials or combinationsthereof. In some embodiments, ILD layer 206 is formed by high densityplasma (HDP) deposition, sub-atmospheric pressure CVD (SACVD), lowpressure CVD (LPCVD), ALD, plasma enhanced ALD (PEALD), plasma enhancedCVD (PECVD), monolayer deposition (MLD), plasma impulse CVD (PICVD),spin-on, or other suitable processes.

Layer set 208 comprises top layer 212 and bottom layer 210. In someembodiments, top layer 212 comprises a silicon-rich photoresistmaterial. In some embodiments, top layer 212 comprises SiON, siliconoxycarbide (SiOC), silicon oxide (SiO), spin-on glass, SiN or othersuitable materials. In some embodiments, top layer 212 comprises asilicon rich organic compound. In some embodiments, the silicon richorganic compound has a silicon content of 40 weight % or more. Top layer212 has a thickness ranging from 10 nanometers (nm) to 20 nm. Forexample, if the thickness of top layer 212 is reduced below 10 nm, thetop layer will be unintentionally removed during processing of layerslocated above the top layer(s), in some instances, in some embodiments.If the thickness of top layer 212 is greater than 20 nm, an aspect ratioof an opening formed in the top layer is unnecessarily increased whichincreases the complexity of etching bottom layer 210, in someembodiments. If the thickness of top layer 212 is above 20 nm,production costs increase due to longer etching times and greatermaterial consumption, in some embodiments.

In some embodiments, bottom layer 210 comprises a carbon-rich organicmaterial. In some embodiments, bottom layer 210 comprises an organicmaterial, spin-on carbon, SiON, or other suitable materials. In someembodiments, bottom layer 210 comprises a non-chemically amplifiedpolymethylmethacrylate (PMMA). In some embodiments, bottom layer 210 isthicker than top layer 212. Bottom layer 210 has a thickness rangingfrom 30 nm to 100. For example, if the thickness of bottom layer 210 isless than 30 nm, the bottom layer will be removed prior to completion ofetching ILD layer 206 which would increase a critical dimension offeatures formed in the ILD layer, in some embodiments. If the thicknessof bottom layer 210 is greater than 100 nm, the aspect ratio of anopening in the bottom layer increases and the critical dimension of thefeatures formed in ILD layer 206 becomes more difficult to control, insome embodiments. In some embodiments, the thickness of bottom layer 210ranges from 50 nm to 100 nm to provide more precise control of thecritical dimension of features formed in ILD layer 206.

BARC layer 214 reduces reflection of light during a lithography processto increase the precision of patterns formed in photoresist layer 216.BARC layer 214 also acts as a mask layer for opening layer set 208. Insome embodiments, BARC layer 214 comprises an organic material. In someembodiments, BARC layer 214 comprises a polymer material having a carbonratio of greater than 80% by weight. In some embodiments, BARC layer 214comprises SiON. In some embodiments, BARC layer 214 is formed by spin-oncoating. In some embodiments, BARC layer 214 is formed by CVD, PVD, ALD,or other suitable processes. BARC layer 214 has a thickness ranging from10 nm to 30 nm. If the thickness of BARC layer 214 is below 10 nm, thenthe BARC layer is removed during a subsequent de-scum process therebypreventing the BARC layer from acting as a mask during the etching oflayer set 208. For example, if the thickness of BARC layer 214 isgreater than 30 nm, production costs are increased as a result ofunnecessary consumption of material and increased processing time toform an opening in the BARC layer, in some embodiments.

Photoresist layer 216 is used to define a pattern to be transferred toILD layer 206 through BARC layer 214, and layer set 208. Photoresistlayer 216 comprises either a positive photoresist material or a negativephotoresist material. In some embodiments, photoresist layer 216 is anextreme ultraviolet (EUV) photoresist material. In some embodiments,photoresist layer 216 is a deep ultraviolet (DUV) photoresist material.In some embodiments, photoresist layer 216 comprises an organic orinorganic polymer having a molecular weight ranging from 2,000 to20,000. In some embodiments, photoresist layer 216 has a thicknessranging from 35 nm to 50 nm. The thickness of photoresist layer 216 isgreater than the thickness of BARC layer 214. For example, if thethickness of photoresist layer 216 is less than 35 nm, the photoresistlayer will be removed during opening of BARC layer 214, which results ininaccurate transfer of the pattern of the photoresist layer to ILD layer206, in some embodiments. If the thickness of photoresist layer 216 isgreater than 50 nm, production costs are increased as a result ofunnecessary consumption of material and increased processing time topattern and open the photoresist layer, in some embodiments.

Returning to FIG. 1, method 100 continues with step 108 in which anopening is formed in the photoresist layer. The photoresist layer ispatterned using a lithography process. In some embodiments, thelithography process is an EUV lithography process which involves lightemitted at a wavelength of approximately 13.5 nm. The small wavelengthof the EUV light enables a denser patterning of the photoresist layer incomparison with light having longer wavelengths. The increased patterndensity reduces the critical dimension of the semiconductor device andfacilitates technology node shrinkage. In some embodiments, thelithography process is a deep ultraviolet (DUV) lithography processwhich involves light emitted at a wavelength ranging from 193 nm to 248nm. The DUV lithography process facilitates a lower LWR parameter thanprocesses involving light having a shorter wavelength.

The opening in the photoresist layer is formed by etching the patternedphotoresist layer to form a mask for the underlying layers. The etchingprocess is either a wet etching or a dry etching process. In someembodiments, an etchant used during the photoresist layer etchingprocess is tetrafluoromethane (CF₄).

FIG. 2B is a cross sectional view of semiconductor device 200 followingstep 108, in accordance with one or more embodiments. An opening 218 isformed in photoresist layer 216. Opening 218 corresponds to a pattern tobe transferred to ILD layer 206 during subsequent processing. Opening218 exposes a portion of BARC layer 214 below photoresist layer 216.

Method 100 continues with step 110 in which a de-scum process isperformed and an opening is formed in the BARC layer. The de-scumprocess removes any trace amounts of photoresist layer in the openingformed in step 108. The de-scum process includes bombarding an exposedsurface of the BARC layer with plasma ions to discharge charges built upin the BARC layer during processing of the photoresist layer. In someembodiments, a supply gas for the plasma ions is nitrogen (N₂), oxygen(O₂), argon (Ar), or other suitable gases. In some embodiments, thede-scum process has an oxygen gas flow rate ranging from 50 standardcubic centimeters per minute (sccm) to 100 sccm, a plasma power rangingfrom 0.6 kilowatts (kW) to 1.0 kW, a plasma frequency ranges from 13.46Hertz (Hz) to 13.66 Hz, and a pressure ranging from 30 miliTorr (mTorr)to 60 mTorr.

The de-scum process will also remove at least a portion of the exposedBARC layer. Any remaining portion of the exposed BARC layer is thenremoved by an additional etching process to form an opening in the BARClayer. The etching process is either a wet etching or a dry etchingprocess. In some embodiments, CF₄ is used as an etchant to form theopening in the BARC layer.

FIG. 2C is a cross sectional view of semiconductor device 200 followingstep 110, in accordance with one or more embodiments. An opening 220extends through photoresist layer 216 and BARC layer 214 to expose aportion of layer set 208. In the embodiment of FIG. 2C, a portion of toplayer 212 is exposed by opening 220.

Method 100 continues with step 112 in which the layer set is etched toform an opening. The etching process transfers the pattern of the BARClayer to the layer set. The etching process also removes the photoresistlayer and the BARC layer to expose a top surface of the layer set. Theetching process is a wet etching or dry etching process. In someembodiments where the layer set includes a plurality of layers, adifferent etching process is used for at least one of the layers of thelayer set. In some embodiments, a single etching process is used to etchthe entire layer set. In some embodiments, an etchant is used forforming the opening in the layer set is CF₄. In some embodiments, theCF₄ etchant is mixed with trifluoromethan (CHF₃) or difluoromethane(CH₂F₂) for more precise control of the dimensions of the opening. Insome embodiments, the etchant used for the forming the opening in thelayer set comprises a mixture of carbonyl sulfide (COS), O₂, N₂ and Ar.In some embodiments, a flow rate of COS ranges from 5 standard cubiccentimeters per minute (sccm) to 50 sccm, a flow rate of O₂ ranges from2 sccm to 150 sccm, a flow rate of N₂ ranges from 100 sccm to 300 sccmand a flow rate of Ar ranges from 100 sccm to 300 sccm.

The etching process forms a tapered opening in the layer set. Thetapered opening is wider at a side of the layer set furthest from theILD layer. In some embodiments, an angle θ between a sidewall of thetapered opening and a top surface of the layer set ranges from about85-degrees to less than 90-degrees. For example, if the angle is lessthan 85-degrees, the aspect ratio of the second layer set increases thedifficulty of etching the ILD layer during a subsequent etching process,in some embodiments. If the angle is greater than 90-degrees, thetapered opening is wider at an interface of the layer set and ILD layerset which increases dimensions of the opening formed during subsequentetching of the ILD layer, in some embodiments. The increased dimensionsof the opening will increase the critical dimension of the semiconductordevice.

FIG. 2D is a cross sectional view of semiconductor 200 following step112, in accordance with one or more embodiments. The etching processforms an opening 224 in layer set 208 and exposes a portion of ILD layer206. The etching process of step 112 also removes photoresist layer 216and BARC layer 214. Sidewalls of opening 224 are tapered such thatopening 224 is wider at a top surface of layer set 208 furthest from ILDlayer 206. An angle θ between the sidewalls of opening 224 and a topsurface of ILD layer 206 ranges from about 85-degrees to about90-degrees, but less than 90-degrees. In some embodiments, opening 224in top layer 212 is also tapered. In some embodiments, an angle betweensidewalls of opening 224 in top layer 212 and an interface betweenbottom layer 210 and the top layer is less than angle θ.

In the embodiment of FIG. 2D, an etchant used to etch top layer 212 isCF₄ and an etchant used to etch bottom layer 210 is the mixture of COS,O₂, N₂ and Ar. In some embodiments, an etching recipe used to etch toplayer 212 comprises 80 sccm to 120 sccm of CF₄ and 10 sccm to 50 sccm ofCHF₃ along with dichloro-silane (DCS). In some embodiments, an etchingrecipe used to etch top layer 212 comprises 100 sccm of CF₄ along withDCS. The etching recipe which includes CHF₃ provides a more taperedprofile of opening 224 in top layer 212, than the recipe without CHF₃.In some embodiments, the etching process for top layer 212 is carriedout under a pressure of 10 mTorr to 80 mTorr, a source power rangingfrom 200 Watts (W) to 400 W, and a bias power ranging from 0 W to 50 W.In some embodiments, an etching recipe used to etch bottom layer 210comprises a flow rate of COS ranges from 5 standard cubic centimetersper minute (sccm) to 50 sccm, a flow rate of O₂ ranges from 2 sccm to150 sccm, a flow rate of N₂ ranges from 100 sccm to 300 sccm and a flowrate of Ar ranges from 100 sccm to 300 sccm. In some embodiments, anetching recipe used to etch bottom layer 210 comprises 20 sccm of COS,20 sccm of O₂, 200 sccm of N₂ and 200 sccm of Ar. In some embodiments,the etching process for bottom layer 210 is carried out under a pressureof 5 mTorr to 30 mTorr, a source power ranging from 400 W to 800 W, anda bias power ranging from 0 W to 50 W.

The inventors believe the COS in the etchant acts to provide a degree ofprotection for sidewalls of opening 224. The protection of the sidewallsof opening causes an etching rate in a direction perpendicular to thetop surface of ILD layer 206 is greater than an etching rate in adirection parallel to the top surface of the ILD layer. The result istapered opening 224.

The tapered opening helps to increase uniformity in openings formed inILD layer 206 by decreasing an aspect ratio of opening 224 at a topportion of the opening. The decreased aspect ratio helps etchant reachthe top surface of ILD layer 206 during subsequent processing. Byincreasing the amount of etchant reaching the top surface of ILD layer206, the processing time for the subsequent etching of the ILD layerdecreases. The decreased processing time in turn lead to less etching ofthe sidewalls of opening 224, so that a constant width is imparted tothe opening formed in ILD layer 206.

A width of opening 224 adjacent to ILD 206 is determined by the criticaldimension of the lithography process and a size of a feature formed inILD 206. A lithography process having a shorter wavelength enablesformation of features having a smaller critical dimension resulting in asmaller width for opening 224. A width of opening 224 adjacent top layer212 depends on the width of opening 224 adjacent ILD 206 and a thicknessof bottom layer 210. A width difference between the width of opening 224adjacent top layer 212 and the width of opening 224 adjacent ILD 206 isindependent of the critical dimension or the size of the feature formedin ILD 206. The width difference ranges, for example, from substantiallyzero, where angle θ is close to 90-degrees regardless of the thicknessof bottom layer 210, to 17.48 nanometers, where angle θ is 85-degreesand the thickness of bottom layer 210 is 100 nm.

For example, if a width of opening 224 adjacent to ILD 206 is 28nanometers and the thickness of bottom layer 210 is 100 nanometers, thewidth of opening 224 adjacent top layer 212 ranges from 28 nanometers to45.48 nanometers. As the thickness of bottom layer 210 decreases, thewidth difference also decreases for angles less than 90-degrees. Forexample, if a width of opening 224 adjacent to ILD 206 is 28 nanometersand the thickness of the bottom layer 210 is 30 nanometers, the width ofopening 224 adjacent top layer 212 ranges from 28 nanometers to 33.24nanometers. In the above example, a percent change of the width ofopening 224 ranges from 18.7%, where the thickness of bottom layer 210is 30 nanometers, to 62.4%, where the thickness of the bottom layer is100 nm.

Method 100 continues with step 114 in which a feature is etched into theILD layer. The etching process transfers the pattern of the layer set tothe ILD layer. The etching process removes at least a portion of thelayer set. The etching process is a wet etching or dry etching process.In some embodiments, the etching process is a two-step etching process.A first etching includes etching an upper portion of the ILD layer withan etchant having low etching selectivity and a high etch rate. A secondetching includes etching a lower portion of the ILD layer with anetchant having a higher selectivity and a lower etch rate. The two stepetching process allows faster processing time in comparison with aprocess using only the highly selective etchant. The two step etchingprocess also reduces the risk of over etching the ILD layer and damagingunderlying layers in comparison with an etching process using only thelow selectivity etchant. In some embodiments, an etchant used in thefirst etching is CF₄, which will also remove portions of the layer set.In some embodiments, an etchant used in the second etching ishexa-fluoro-butadiene (C₄F₆).

FIG. 2E is a cross sectional view of semiconductor device 200 followingstep 114, in accordance with one or more embodiments. The etchingprocess forms an opening 226 through ILD layer 206. The etching processof step 114 also removes top layer 212 and at least a portion of bottomlayer 210. Sidewalls of opening 226 are substantially vertical, suchthat a width of opening 226 is constant from the top surface of ILDlayer 206 to a bottom surface of the ILD layer.

Method 100 continues with optional step 116 in which ashing is performedto remove any remaining portion of the layer set to expose the topsurface of the ILD layer. In some embodiments, the etching of step 114will completely remove the layer set and step 116 is omitted. In someembodiments, the etching of step 114 does not completely remove thelayer set and the remaining portion of the layer set is removed byashing. The ashing uses an oxygen-based plasma to remove the remainingportions of the layer set. In some embodiments, the oxygen-based plasmais mixed with N₂, H₂, CO, CO₂, nitrogen oxide (NO), nitrogen dioxide(NO₂), ammonium (NH₃) or other suitable materials. The ashing processexposes the top surface of the ILD layer.

FIG. 2F is a cross sectional view of semiconductor device 200 followingstep 116, in accordance with one or more embodiments. The ashing processremoves any remaining material of bottom layer 210 to expose the topsurface of ILD layer 206. Opening 226 in ILD layer 206 corresponds toeither a trench or a via. Opening 226 has a LWR of less than 3 nm.

FIG. 3A is a top view of a via 300 formed in ILD layer 206 in accordancewith one or more embodiments. Via 300 includes sidewalls 302. Sidewalls302 are rough as a result of small process variations during the etchingprocess of step 116. In some instances, recessed portions of sidewalls302 are partially filled with by-product materials 304 which result fromthe etching process. By-product materials 304 are deposited within therecessed portions of sidewalls 302 during the etching process and theby-product materials reduce the roughness of opening 226. The inventorsbelieve the angle of opening 224 helps to conduct by-product materials304 into opening 226 which enables a higher degree of filling of therecessed portions of sidewalls 302. The resulting structure of opening226 has a lower LWR in comparison with techniques which do not includethe angle of opening 224.

FIG. 3B is a cross sectional view of via 300 formed in ILD layer 206 inaccordance with one or more embodiments. The cross sectional view of via300 shows that by-product materials 304 partially fill in recessedportions of sidewalls 302 along an entire depth of opening 226.

In some embodiments, additional processing steps such as metallizationsteps and chemical-mechanical polishing (CMP) steps are performed toform a final semiconductor device. In some embodiments, method 100 isrepeated several times to form several different features in ILD layer206. In some embodiments, a dual damascene process is used to formadditional conductive lines and vias.

Method 100 is advantageous for production processes which utilizeadvance lithography processes, such as e-beam or EUV lithography. Forexample, EUV lithography experiences an increased LWR with respect tolithography processes using longer wavelengths. Additionally, processesdesigned for EUV lithography include thinner layers, which increases therisk of damage during cleaning processes or de-scum processes. Thesefactors make controlling LWR during an EUV lithography processdifficult. However, by tapering opening 224 in bottom layer 210, LWR ofopening 226 in ILD 206 is effectively controlled to be less than 3nanometers.

One aspect of this description relates to a method of forming asemiconductor device. The method includes forming a dielectric layerover a substrate. The method further includes forming a layer set overthe dielectric layer, wherein the layer set comprises a plurality oflayers. The method further includes forming a bottom antireflectivecoating (BARC) layer over the layer set. The method further includesetching the layer set to form a tapered opening in the layer set,wherein etching the layer set comprises etching at least one layercomprising a silicon-rich photoresist material layer and a secondmaterial layer different from the silicon-rich photoresist material, andthe tapered opening has sidewalls at an angle with respect to a topsurface of the dielectric layer. The method further includes etching thedielectric layer using the layer set as a mask to form an opening in thedielectric layer, wherein etching the dielectric layer comprisesreducing a thickness of the layer set.

Another aspect of this description relates to a method of making asemiconductor device. The method includes forming a dielectric layerover a substrate. The method further includes forming a layer set overthe dielectric layer, wherein the layer set comprises a plurality oflayers. The method further includes forming a bottom anti-reflectivecoating (BARC) layer over the layer set. The method further includesforming a photoresist layer over the BARC layer; and forming an openingin the photoresist layer. The method further includes etching the BARClayer using the photoresist layer as a mask to form an opening in theBARC layer. The method etching the layer set using the BARC layer as amask to form a tapered opening in the layer set, wherein etching thelayer set comprises etching at least one layer comprising a silicon-richphotoresist material layer and a second material layer different fromthe silicon-rich photoresist material, and the tapered opening has anopening in a top surface of the layer set having a first width and anopening in a bottom surface of the layer set having a second width. Themethod further includes etching the dielectric layer using the layer setas a mask to form an opening in the dielectric layer, wherein etchingthe dielectric layer comprises substantially removing at least one layerof the plurality of layers.

Still another aspect of this description relates to a method of making asemiconductor device. The method includes forming an intermediatesemiconductor device. The intermediate semiconductor device includes adielectric layer; and a layer set over the dielectric layer. The layerset includes a silicon-rich photoresist material layer, and acarbon-rich organic material layer. The intermediate semiconductordevice further includes a bottom antireflective coating (BARC) layerover the layer set; and a photoresist layer over the BARC layer. Themethod further includes etching the layer set to form a tapered openingin the layer set, the tapered opening having sidewalls at an angle withrespect to a top surface of the dielectric layer, wherein etching thelayer set comprises substantially removing the BARC layer. The methodfurther includes etching the dielectric layer using the layer set as amask to form an opening in the dielectric layer.

It will be readily seen by one of ordinary skill in the art that thedisclosed embodiments fulfill one or more of the advantages set forthabove. After reading the foregoing specification, one of ordinary skillwill be able to affect various changes, substitutions of equivalents andvarious other embodiments as broadly disclosed herein. It is thereforeintended that the protection granted hereon be limited only by thedefinition contained in the appended claims and equivalents thereof.

What is claimed is:
 1. A method of forming a semiconductor device, themethod comprising: forming a dielectric layer over a substrate; forminga layer set over the dielectric layer, wherein the layer set comprises aplurality of layers; forming a bottom antireflective coating (BARC)layer over the layer set; etching the layer set to form a taperedopening in the layer set, wherein etching the layer set comprisesetching at least one layer comprising a silicon-rich photoresistmaterial layer and a second material layer different from thesilicon-rich photoresist material, and the tapered opening has sidewallsat an angle with respect to a top surface of the dielectric layer; andetching the dielectric layer using the layer set as a mask to form anopening in the dielectric layer.
 2. The method of claim 1, wherein theetching the layer set comprises using carbonyl sulfide (COS).
 3. Themethod of claim 2, wherein the etching the layer set comprises supplyingCOS at a flow rate of 5 standard cubic centimeters per minute (seem) to50 seem.
 4. The method of claim 1, wherein etching the dielectric layercomprises forming the opening in the dielectric layer having a linewidth roughness (LWR) of less than 3 nanometers (nm).
 5. The method ofclaim 1, wherein the etching the dielectric layer comprises a two stepetching process comprising: etching a top portion of the dielectriclayer with a first etchant; and etching a bottom portion of thedielectric layer with a second etchant different than the first etchant.6. The method of claim 5, wherein the two step etching process comprisesusing the first etchant comprising tetrafluoromethane (CF4) and thesecond etchant comprising hexa-fluoro-butadiene (C4F6).
 7. The method ofclaim 1, wherein etching the second material layer comprises etching acarbonrich organic material layer.
 8. The method of claim 1, whereinreducing the thickness of the layer set comprises removing at least onelayer of the plurality of layers.
 9. The method of claim 1, whereinetching the layer set comprises reducing a thickness of the BARC layer.10. A method of making a semiconductor device, the method comprising:forming a dielectric layer over a substrate; forming a layer set overthe dielectric layer, wherein the layer set comprises a plurality oflayers; forming a bottom anti-reflective coating (BARC) layer over thelayer set; forming a photoresist layer over the BARC layer; forming anopening in the photoresist layer; etching the BARC layer using thephotoresist layer as a mask to form an opening in the BARC layer;etching the layer set using the BARC layer as a mask to form a taperedopening in the layer set, wherein etching the layer set comprisesetching at least one layer comprising a silicon-rich photoresistmaterial layer and a second material layer different from thesilicon-rich photoresist material, and the tapered opening has anopening in a top surface of the layer set having a first width and anopening in a bottom surface of the layer set having a second width; andetching the dielectric layer using the layer set as a mask to form anopening in the dielectric layer.
 11. The method of claim 10, wherein theetching the layer set comprises using carbonyl sulfide (COS).
 12. Themethod of claim 11, wherein the etching the layer set comprisessupplying COS at a flow rate of 5 standard cubic centimeters per minute(seem) to 50 seem.
 13. The method of claim 10, wherein the opening inthe dielectric layer has a line width roughness (LWR) of less than 3nanometers (nm).
 14. The method of claim 10, wherein the etching thedielectric layer comprises a two step etching process comprising:etching a top portion of the dielectric layer with a first etchant; andetching a bottom portion of the dielectric layer with a second etchantdifferent than the first etchant.
 15. The method of claim 14, whereinthe two step etching process comprises using the first etchantcomprising tetrafluoromethane (CF4) and the second etchant comprisinghexa-fluorobutadiene (C4F6).
 16. The method of claim 10, wherein etchingthe second material layer comprises etching a carbon-rich organicmaterial layer.
 17. The method of claim 10, wherein forming the layerset comprises forming a single layer set.
 18. The method of claim 10,wherein the forming the opening in the photoresist layer comprisesperforming a photolithography process using a light source having anextreme ultraviolet (EUV) wavelength.
 19. The method of claim 10,wherein etching the layer set comprises forming the tapered openinghaving sidewalls at an angle with respect to a top surface of the ILDlayer ranging from about 85-degrees to less than 90-degrees.
 20. Amethod of making a semiconductor device, the method comprising: formingan intermediate semiconductor device, the intermediate semiconductordevice comprising: a dielectric layer; a layer set over the dielectriclayer, wherein the layer set comprises: a silicon-rich photoresistmaterial layer, and a carbon-rich organic material layer; a bottomantireflective coating (BARC) layer over the layer set; and etching thelayer set to form a tapered opening in the layer set, the taperedopening having sidewalls at an angle with respect to a top surface ofthe dielectric layer, wherein etching the layer set comprisessubstantially removing the BARC layer; and etching the dielectric layerusing the layer set as a mask to form an opening in the dielectriclayer.